In modern high-end manufacturing, particularly in electronics, communications, automotive electronics, and medical devices, high-density electronic connectors place extremely stringent demands on the dimensional accuracy and consistency of internal metal parts. These connectors often integrate dozens or even hundreds of tiny terminals, springs, or signal pins, spaced very closely together and subject to extremely narrow assembly tolerances. Any slight dimensional deviation or deformation can lead to abnormal insertion and removal forces, poor contact, signal interference, or even complete failure of the entire assembly. Therefore, precision stamping, as a core process for manufacturing these microscopic metal parts, must achieve micron-level dimensional accuracy and long-term, stable, and highly repeatable performance to meet the stringent assembly requirements of modern electronic connectors. Achieving this goal primarily relies on the coordinated use of highly rigid and stable stamp